美国Bondline医疗级常温环氧银胶

时间：2023-02-16

我司是美国Bondline在国内代理商，我司具备化学品零下45度从美国低温孔空运的优势，目前合作的客户有医电子，半导体等行业客户，美国Bondline医级材料符合USPClass VI 认证。

美国Bondline为半导体、医设备、微电子和航空航天行业的公司提供高质量的环氧树脂粘合剂。Bondline生产解决复杂问题的特种粘合剂材料。1：医用级胶粘剂我们生产医疗级粘合剂，包括符合 USP VI类标准的导管组件、无菌一次性用品、换能器组件、诊断设备、针头组件、超声波、光学透明其他医疗电子产品。2：包装胶作为可靠和高性能薄膜和糊状粘合剂、合规和低释气粘合剂、散热（管理）粘合剂、芯片连接粘合剂、底部填充粘合剂、中介层粘合剂的制造商和供应商，粘合剂满足CSP 要求 3：电子级胶粘剂我们生产电子级粘合剂，包括芯片贴装、SMT、散热器、底部填充、封装等材料。

Bondlinesupplieshigh performance epoxy adhesives to companies in thesemiconductor, medical device, microelectronic, and aerospaceindustries.Bondline manufactures cutting-edge specialty adhesivematerials that solve complex problems.1：Medical Grade AdhesivesWemanufacture medical grade adhesives including USP Class VIcompliant, catheter assembly, sterile disposables, transducerassembly, diagnostic e, needle assembly, ultrasound,optically clear other medical electronics.2：PackagingAdhesivesAdhesives meeting CSP re as a manufacturer andSupplier of Reliable and High Performance Film and Paste Adhesives,Compliant and Low Outgassing Adhesives, Thermal Dissipation(Management) Adhesives, Die Attach Adhesives, Underfill Adhesives,Interposer Adhesives3：Electronic GradeAdhesivesBondline

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